Results & Highlights
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Elaboration and realization of the highly challenging full manufacturing chain for 3D system integration – a complex manufacturing chain that was never realized before! – was key for success. Instead of setting up 3 different MSP demonstrators, the MSP consortium decided to head for a unique 3-in-1 multi-functional MSP demonstrator for wearable applications combining all the features of the planned demonstrators except particle sensing. This is by far the most challenging demonstrator system with respect to required minimum footprint, minimum power consumption, and maximum number of sensor device.
The final MSP-demonstrator system was designed, sophisticated sensor devices were fabricated, 3D-integrated on the platform chip, and finally mounted on a specific PCB including the wireless communication. The wearable wristband device with integrated MSP-demonstrator is the ultimate output of the MSP-project. The MSP multi sensor system comprising a total of 57 sensor devices is a unique device worldwide – such a complex system has never been realized before.
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In more detail, the MSP project features the following highlights:
- A variety of highly sophisticated gas sensors based on nanomaterials such as SnO2, CuO, ZnO, and WO3 nanowires, (bi)metallic nanoparticles, their hybrid combinations, and graphene(oxide), have been developed,
- Realization of highly promising CO2 sensors based on very specific hybrid nanomaterials,
- An electronic platform chip based on TSV technology has been designed and fabricated as stacking platform for the sensor devices,
- Development and fabrication of 8x microhotplate array for 16 gas sensors on a single chip – this is a worldwide unique gas sensor array,
- Development of GaN-on-Si technology based micro-hotplate and integration of GaN/AlGaN 2-D electron gas sensor for NO2,
- Realization of hybrid MEMS-FBAR based micro sensor system utilizing high frequency acoustic wave devices for the real time monitoring of airborne fine particulates (< 2.5 µm),
- SiC-based UV-A/B sensors, development of sensors for visible light with near photopic responsivity, and development of thermopile-based infrared sensors,
- Development of optimized photovoltaic energy harvester based on black-Si and Interdigitated Back Contact with double side passivation using Al2O3
- Development of piezoelectric energy harvester demonstrator based on transparent, flexible and thin PVDF films (P(VDF-TrFE) and P(VDF-TrFE-CTFE)) with enough energy to power up an array of 44 LEDs
- Development of microcontroller SoC with record computing efficiency at the full SoC level being a 10× improvement compared to the 2017 research state of the art,
- A complex manufacturing process has been elaborated and realized to enable the fabrication of the 3D-stacked multi-sensor system by TSV-technology and wire-bonding,
- A specific overmolding process has been applied to realize the fully overmolded MSP demonstrator system exhibiting an extremely challenging topography due to different thickness and geometry of the devices. Such a complex system has never been realized so far,
- A new wristband device has been designed and fabricated to end up with a wearable showcase for the MSP demonstrator,
- The MSP demonstrator is a fully 3D-integrated overmolded multi-sensor system comprising a total of 57 sensor – this is a unique sensor system worldwide.
