New Project Ideas

Realization of the highly challenging full manufacturing chain for 3D smart system integration including overmolding is the most important innovation of the MSP project along with the outstanding variety and multitude of sensor devices which have been integrated to a high-performance system.

The MSP consortium is looking for new project ideas to further exploit the project results and to push European activities in Smart System Integration in terms of H2020 or ECSEL projects. The development of innovative multi-sensor systems, such as 3D-integrated gas sensor arrays combined with visible and infrared light sensors for Smart Building applications is now feasible thanks to the innovations of the MSP project. Nano-based gas sensors, for example, require further R&D-projects to push the TRL to higher levels and to solve reliability issues.

We thus are actively elaborating and pushing new project ideas! Please contact us with your project ideas whenever they could be realized by MSP innovations!

MSP is funded by the European Union
under EU Framework Programme 7