Three breakthroughs have been achieved within the MSP-project:
- Within period 1 (1/9/2013 – 31/8/2014) the MSP team has elaborated the overall concept to finalize with overmolded 3D-integrated MSP demonstrator devices,
- Within period 2 (1/9/2014 – 31/8/2015) the full manufacturing chain for system integration has been elaborated, and all sensor devices being finally integrated on the CMOS-Platform chip to 3D-integrated multi-sensor systems have been selected,
- Within period 3 (1/9/2015 – 30/4/2017) the MSP team has decided to head for the ultimate goal and to realize a unique 3-in-1 MSP demonstrator for wearable wristband application.
