The MSP project - Multi Sensor Platform for Smart Building Management - is focused on the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The MSP-project employs Through-Silicon-Via (TSV) technology for 3D-integration of these devices on CMOS electronic platform chips to innovative smart systems capable for indoor and outdoor environmental monitoring.
The MSP project will deliver highly competitive production technologies enabling the flexible "plug-and-play" integration of nanotechnology based multi-sensor systems with CMOS electronic chips. The MSP project aims to develop novel technologies that can sense multiple hazardous gases and other environmental parameters. This could open entirely new applications in smart building management and the ability to use smart phones to monitor air quality and detect harmful gases like carbon monoxide in the home.
The €18 million MSP project aims to strengthen the leadership of European industries in the competitive area of smart sensing systems. The MSP concept is based on a multi-project wafer (MPW) approach which allows for cost-efficient fabrication of prototypes and low volume products. This concept is dedicated in particular to innovative SMEs to enable early take up of KETs for highly innovative product development.
The three-year FP7 project MSP is led by Materials Center Leoben (MCL) and comprises of 17 large and small companies, universities and public research centres from 6 European countries. The MSP project started in September 2013 and is due to complete in 2016.